Using QCM-D for CMP Cleaning Applications
Several different slurry and substrate materials are used during Chemical Mechanical Planarization (CMP) and post CMP cleaning. With the ever-changing needs in the Semiconductor industry, it can be important to understand from a fundamental point of view how these materials are interacting. That is where Quartz Crystal Microbalance with Dissipation (QCM-D) can help. QCM-D can be used to understand how different slurry components chemically interact with a particular substrate material in real-time.
One example for the real-time monitoring by QCM-D is illustrated with using benzotriazole (BTA) as a corrosion inhibitor for Cu interconnects in slurry formulations. QCM-D can be used to quantify the amount of BTA that will adsorb onto the Cu surface. Additionally, the removal of BTA via acetohydroxamic acid (AHA) as a post CMP cleaning step can be quantified. Additionally, silica or ceria particles are often used in dielectric CMP slurry formulations and their surface mass loading and subsequent removal via cleaning can be quantified via QCM-D.
Join Dr. Matthew Dixon of Nanoscience Instruments as he presents on the theory of QCM-D and how it can be used for quantifying processes related to CMP applications.During the presentation:
- Learn how the QCM-D technique works.
- Discover the different configurations available.
- Gain insight into specific application example relevant for CMP in integrated circuit design.