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Nanoscience Instruments Expands Nanoindentation Portfolio Featuring Complete Line of KLA-Tencor Systems

Expanded nanoindentation product line to include the iNano®, iMicro, inSEM® HT and NanoFlip. Founded upon technology pioneered by Dr. Warren Oliver, these systems along with the Nano Indenter® G200 represent a complete portfolio of ambient and in situ nanoindentation solutions from KLA-Tencor.

Nanoscience Instruments, proud partner of KLA-Tencor Corporation, is expanding their nanoindentation offering to include the iNano®iMicroinSEM® HT and NanoFlip product lines. Founded upon technology pioneered by Dr. Warren Oliver, these systems along with the Nano Indenter® G200 represent a complete portfolio of ambient and in situ nanoindentation solutions from KLA-Tencor.

KLA-Tencor Corporation is a leading provider of process control and yield management solutions. They partner with customers around the world to develop state-of-the-art inspection and metrology technologies serving the semiconductor and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 40 years.

Nanoscience Instruments has become a trusted supplier of the most innovative and highest quality analytical solutions to academia and industry. The expansion of the nanoindentation portfolio enables them to provide the most comprehensive line of nanoindentation solutions to their customers.

As the ground-breaking nanoindentation paper by Dr. Warren Oliver (Oliver and Pharr, JMR, 1992) approaches 20,000 citations, nanoindenters continue to gain adoption in many industries for static and dynamic nanomechanical characterization of material surfaces. The KLA-Tencor nanoindentation products offered by Nanoscience Instruments are flexible and user-friendly, featuring fast throughput with consistent and reproducible results—including the capability to conduct substrate-independent measurements of thin films under various temperatures and environments. Applications include semiconductor, thin films, and MEMS (wafer applications); hard coatings and DLC films; composite materials, fibers, and polymers; metals and ceramics; and biomaterials and biology.