The SC-2000 model is equipped both with high- and low-energy ion sources. Rapid slope cutting with the high-energy ion gun followed by gentle surface cleaning with the low-energy ion gun provides cross-sectional SEM samples suitable for semiconductor failure analysis and other analytical purposes. The system also provides an ion milling based solution for improving and cleaning of mechanically polished SEM samples and preparation of damage-free surfaces for EBSD technique. The new 16 keV ultra-high energy ion source is more powerful and has higher sputtering rate as before.
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