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Broad Ion Beam Polishers

EM Sample Preparation

Broad Ion Beam Polishers

Broad ion beam polishing is an essential part of the sample preparation process for electron microscopy analysis. This versatile method can remove surface contamination, planarize mechanically cross-sectioned samples, or thin and polish electron-transparent lamellae.

Technoorg Linda has devoted over 35 years to continuous innovation and improvement resulting in outstanding, easy-to-use, and reliable equipment. Their ion milling technology are used in a variety of fields including material science, biological science, geology, failure analysis, metallurgy, battery, aerospace, semiconductor, and electronics in both SEM and TEM preparation.

Artifact-Free Samples

Quickly prepare samples for high quality EBSD, cross-sectional analysis, or atomic-resolution imaging

Automated Operation

Produce high quality samples with minimum user intervention by leveraging an intuitive graphical interface

Unsurpassed Thinning Rates

Variable ion sources for continuous adjustment of milling energy achieves rapid and controlled thinning

Dual Cooling Options

Both liquid nitrogen and Peltier cooling options are available to protect the heat-sensitive samples

See available options

Broad Ion Beam Polisher Models

The newest generation of ion milling equipment from Technoorg Linda operates under a new, uniform platform. Choose from the highest-quality, easiest to use, and most reliable ion polishing tools worldwide. With a focus on compatibility and versatility, each product delivers consistent and controlled milling for high-quality SEM and TEM analysis.

Intelligent SEM Sample Preparation

SEMPREP SMART is a state-of-the-art, automated BIB milling system designed for high-quality SEM sample preparation. A beam of high-energy argon ions bombards the surface to gently removing material at an accelerated rate. This process reveals the true sample underneath by producing damage-free and artifact-free surfaces.

Automated TEM Sample Preparation

UniMill enables rapid, affordable TEM sample preparation without use of a focused ion beam (FIB). Dual ion sources, one high-energy source with unparalleled thinning rates and one patented, low-energy source for final cleaning, work together to create superb electron transparent samples.

Enhance FIB Lamellae for TEM

GentleMill is a stand-alone, automated BIB polishing system designed for post-processing of focused ion beam (FIB) lamellae, some of the hardest-to-produce samples for TEM. Low-energy argon ions are used to perform a final cleaning of the sample surface, gently removing damaged or amorphized layers incurred from high-energy FIB milling.

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Model:

SEMPrep SMART

UniMill

GentleMill

Ion Source Ultra high-energy (up to 16 keV) standard standard n/a
High-energy (up to 10 keV) standard standard n/a
Low energy (100 eV - 2 keV) optional standard standard
Milling energy continuously adjustable continuously adjustable continuously adjustable
Sample Stage Tilt range 0° - 30° in 0.1° steps 0° - 30° in 0.1° steps 0° - 30° in 0.1° steps
In-plane rotation yes yes n/a
In-plane oscillation ±180° in 0.1° steps ±180° in 0.1° steps -30° to +10° in 0.1° steps
In-situ swinging ±2.5 mm n/a n/a
Sample holder types Surface polish, 30° slope cut, 90° slope cut Single-sided, double-sided, FIB cartridge, surface polish FIB cartridge, single-sided, double-sided, surface polish
Thickness range of TEM sample n/a 30 - 200 µm 30 - 200 µm
LN2 cooling optional optional optional
Peltier cooling optional optional optional
Vacuum system oil-free diaphragm + turbomolecular pumps
Gas supply 99.999% pure argon
Imaging system Camera high-resolution (5 MP) color CMOS
Magnification 50 - 400x
Computer Control Interface easy-to-use graphical interface
Automated ion source control yes
Milling protocol Automated or manual, recipes included
Automatic perforation detection n/a yes n/a

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