Transmission electron microscopy (TEM) is one of the cornerstones of advanced materials characterization, allowing researchers to peer directly into structures at the atomic level to better understand their properties. Increasingly dominant in the semiconductor and nanomaterials space, the demand for high-quality TEM data is subsequently increasing. As materials become more sophisticated and demand for high-quality data increases, better methodologies need to be employed to fulfill that need.
Preparation of samples suitable for analysis via TEM is both extremely sophisticated and time intensive. Most commonly, these are prepared using a focused ion beam (FIB) installed in scanning electron microscope (SEM) to quickly identify a site of interest, carve out, extract, and continuously thin a lamella until it is electron transparent. FIB milling commonly creates obstructing artefacts, such as amorphization and redeposition, while also requiring significant expertise and capital to properly operate.
Join us for this webinar as we introduce the new UniMill, GentleMill, and Gentle Ion Beam; the latest generation of broad ion beam polishers from Technoorg Linda. These tools have been designed to be both an alternative to traditional FIB-based sample preparation and provide superb post processing of FIB-prepared lamella. Explore the evolution of TEM sample preparation equipment and discover the invisible.
